Cisco UCS X9508 Chassis Models:

Cisco UCS X9508 Chassis Specification:

• Height: 12.05 in (30.6 cm); 7 RU
• Width: 17.55 in (44.6 cm); fits standard 19-inch square-hole rack
• Depth: 34.81 in (88.4 cm)
• Node Slots: 8
• Intelligent Fabric Module (IFM): 2 x Cisco UCS 9108 Intelligent Fabric Module with 8x 25G SFP28 ports
• X-Fabric Module Slot: 2 x Cisco UCS X-Fabric module rear blank slots (for future expansion)
• Fan Module: 4 x 100mm hot-swappable dual rotor fans
• Power Supply Bays: 6
• Power Supplies: 2800W Titanium certified
• Input Voltage: 100 to 127 V AC; 200 to 240V AC
• Maximum Input VA: 3200 VA at 230 VAC
• Maximum Output Power per Power Supply:
  • 2800 W @200-240 VAC Nominal
  • 1400 W @100-127 VAC Nominal

Cisco UCS X9508 Chassis Features:

• 7-Rack-Unit (7RU) chassis has 8x front-facing flexible slots. These can house a combination of compute nodes and a pool of future I/O resources that may include GPU accelerators, disk storage, and nonvolatile memory.
• 2x Cisco UCS 9108 Intelligent Fabric Modules (IFMs) at the top of the chassis that connect the chassis to upstream Cisco UCS 6400 Series Fabric Interconnects. Each IFM features
• Up to 100 Gbps of unified fabric connectivity per compute node
• 8x 25-Gbps SFP28 uplink ports. The unified fabric carries management traffic to the Cisco Intersight cloud-operations platform, Fiber Channel over Ethernet (FCoE) traffic, and production Ethernet traffic to the fabric interconnects.
• At the bottom are slots ready to house future I/O modules that can flexibly connect the compute modules with I/O devices. We call this connectivity Cisco UCS X-Fabric technology because “X” is a variable that can evolve with new technology developments.
• Six 2800W Power Supply Units (PSUs) provide 54V power to the chassis with N, N+1, and N+N redundancy. A higher voltage allows efficient power delivery with less copper and reduced power loss.
• Efficient, 4x100mm, dual counter-rotating fans deliver industry-leading airflow and power efficiency. Optimized thermal algorithms enable different cooling modes to best support the network environment. Cooling is modular so that future enhancements can potentially handle open- or closed-loop liquid cooling to support even higher-power processors.

Additional information